4

Electrical and thermal specifications

4.1

Absolute maximum ratings

Stresses beyond those listed in Table 2 may cause permanent damage to the device. These are stress ratings

only and operation of the device at these or any other condition above those indicated in Table 2 is not implied.

Exposure to absolute maximum rated conditions for extended periods may affect device reliability.

Table 2. Absolute maximum ratings

Parameter

Pin(s)

Min.

Max.

Unit

Pin voltage range

AC1, AC2 respect to ground (VSSA, VSSD and VSSP

pins)

-0.9

27

V

BOOT1 to AC1

-0.3

5.5

BOOT2 to AC2

BOOT1 and BOOT2 respect to ground (VSSA, VSSD

and VSSP pins)

-0.3

27

VINV, VIN respect to ground (VSSA, VSSD and VSSP

pins)

-0.7

27

V1V8, NTC, VS and ADC respect to ground (VSSA,

VSSD and VSSP pins)

-0.3

1.98

V5V0 respect to ground (VSSA, VSSD and VSSP pins)

-0.7

5.5

GPIO0 through GPIO5,GPIO7, INTB, RSTB, SDA,

SCL respect to ground (VSSA, VSSD and VSSP pins)

-0.7

5.5

Relative voltage between any ground pin (VSSA,

VSSD, VSSP)

-0.3

0.3

RMS Current

AC1,AC2,VINV

2.0

A

HBM ESD susceptibility

JEDEC JS001-2012

All pins

2000

V

CDM ESD susceptibility

JEDEC JS002-2012

500

Latch-Up EIA/JESD78E

-200

200

mA

4.2

Thermal characteristics

Table 3. Thermal characteristics

Symbol

Parameter

Conditions

Min.

Typ.

Max.

Unit

TA,OP(1)

Operating ambient temperature

-40

85

°C

TJ,OP

Operating junction temperature

0

125

RϴJA(2)

Junction to ambient thermal resistance

2s2p

47

°C/W

1. Ta -40°C to 85°C , limits over the operating temperature range and relevant supply voltage range are guaranteed by design

and characterization,if not otherwise specified.

2. Device mounted on a standard JESD51-5 test board

STWBC86

Electrical and thermal specifications

DS14079 - Rev 1

page 6/40