P9225-R Datasheet

© 2018 Integrated Device Technology, Inc.

2

November 12, 2018

Contents

1. Pin Assignments...........................................................................................................................................................................................5

2. Pin Descriptions............................................................................................................................................................................................6

3. Absolute Maximum Ratings..........................................................................................................................................................................8

4. Thermal Characteristics................................................................................................................................................................................9

5. Electrical Characteristics ..............................................................................................................................................................................9

6. Typical Performance Characteristics..........................................................................................................................................................12

7. Functional Block Diagram...........................................................................................................................................................................15

8. Theory of Operation....................................................................................................................................................................................16

8.1 LDO – Low Dropout Regulators ........................................................................................................................................................16

8.2 Setting the Output Voltage – VOSET ................................................................................................................................................16

8.3 SINK Pin............................................................................................................................................................................................17

8.4 Rectifier Voltage – VRECT................................................................................................................................................................17

8.5 Over-Current Limit – ILIM..................................................................................................................................................................17

8.6 Interrupt Function – INT.....................................................................................................................................................................17

8.7 Enable Pin – EN ................................................................................................................................................................................18

8.8 Thermal Protection ............................................................................................................................................................................18

8.9 External Temperature Sensing – TS .................................................................................................................................................18

8.10 End of Charge – EOC........................................................................................................................................................................18

8.11 Received Power Packet Offset and Gain Calibration – RPPO and RPPG........................................................................................18

8.12 Advanced Foreign Object Detection (FOD).......................................................................................................................................19

9. Communication Interface............................................................................................................................................................................20

9.1 Modulation/Communication...............................................................................................................................................................20

9.2 Byte Encoding for ASK......................................................................................................................................................................20

9.3 Packet Structure................................................................................................................................................................................20

10. WPC Mode Characteristics ........................................................................................................................................................................21

10.1 Selection Phase or Startup................................................................................................................................................................21

10.2 Ping Phase (Digital Ping)...................................................................................................................................................................22

10.3 Identification and Configuration Phase..............................................................................................................................................22

10.4 Power Transfer Phase.......................................................................................................................................................................22

11. Functional Registers...................................................................................................................................................................................23

12. I2C Access Description ..............................................................................................................................................................................28

13. Application Information...............................................................................................................................................................................29

13.1 Power Dissipation and Thermal Requirements .................................................................................................................................29

13.2 Recommended Coils .........................................................................................................................................................................30

13.3 Typical Application Schematic...........................................................................................................................................................31

13.4 Bill of Materials (BOM).......................................................................................................................................................................32

14. Package Outline Drawings .........................................................................................................................................................................33

15. Special Notes: WLCSP-52 (AHG52) Package Assembly...........................................................................................................................33