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ADL8112ACCZ-R7 数据表(PDF) 8 Page - Analog Devices |
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ADL8112ACCZ-R7 数据表(HTML) 8 Page - Analog Devices |
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8 / 27 page ![]() Data Sheet ADL8112 ABSOLUTE MAXIMUM RATINGS analog.com Rev. 0 | 8 of 27 Table 8. Absolute Maximum Ratings Parameter Rating VDD1 11.5 V VDD2 −0.3 V to +3.6 V VSS2 −3.6 V to +0.3 V Control Voltage (VA, VB) Range ±0.3 V to VDD2 RF Input Power (RFIN) (Derate at Lower Frequencies, According to Figure 2) Internal Amplifier Mode 23 dBm Internal/External Bypass Mode 27.5 dBm Hot Switch Power Level 22 dBm Internal Amplifier Mode External/Internal Switch Mode 27.5 dBm Continuous Power Dissipation (PDISS) (TA = 85°C, Derate 6.8 mW/°C Above 85°C) 0.61 W Temperature Channel 175°C Storage Range −40°C to +125°C Operating Range −40°C to +85°C Stresses at or above those listed under Absolute Maximum Ratings may cause permanent damage to the product. This is a stress rating only; functional operation of the product at these or any other conditions above those indicated in the operational section of this specification is not implied. Operation beyond the maximum operat- ing conditions for extended periods may affect product reliability. THERMAL RESISTANCE Thermal performance is directly linked to the printed circuit board (PCB) design and operating environment. Careful attention to PCB thermal design is required. θJC is the junction to case thermal resistance. Table 9. Thermal Resistance Package Type θJC Unit CC-28-4 92 °C/W RF INPUT POWER DERATING CURVE Figure 2. RF Input Power Derating Curve ELECTROSTATIC DISCHARGE (ESD) RATINGS The following ESD information is provided for handling of ESD-sen- sitive devices in an ESD protected area only. Human body model (HBM) per ANSI/ESDA/JEDEC JS-001. ESD Ratings for ADL8112 Table 10. ADL8112, 28-Terminal LGA ESD Model Withstand Threshold (V) Class HBM ±250 1A ESD CAUTION ESD (electrostatic discharge) sensitive device. Charged devi- ces and circuit boards can discharge without detection. Although this product features patented or proprietary protection circuitry, damage may occur on devices subjected to high energy ESD. Therefore, proper ESD precautions should be taken to avoid performance degradation or loss of functionality. |
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