AD9411

Rev. A | Page 27 of 28

OUTLINE DIMENSIONS

TOP VIEW

(PINS DOWN)

1

25

26

50

76

100

75

51

14.00 SQ

16.00 SQ

0.27

0.22

0.17

0.50 BSC

1.05

1.00

0.95

0.15

0.05

0.75

0.60

0.45

SEATING

PLANE

1.20

MAX

1

25

26

50

76

100

75

51

CONDUCTIVE

HEAT SINK

6.50

NOM

COMPLIANT TO JEDEC STANDARDS MS-026AED-HD

NOTES

1. CENTER FIGURES ARE TYPICAL UNLESS OTHERWISE NOTED.

2. THE AD9411 HAS A CONDUCTIVE HEAT SLUG TO HELP DISSIPATE HEAT AND ENSURE RELIABLE OPERATION OF

THE DEVICE OVER THE FULL INDUSTRIAL TEMPERATURE RANGE. THE SLUG IS EXPOSED ON THE BOTTOM OF

THE PACKAGE AND ELECTRICALLY CONNECTED TO CHIP GROUND. IT IS RECOMMENDED THAT NO PCB SIGNAL

TRACES OR VIAS BE LOCATED UNDER THE PACKAGE THAT COULD COME IN CONTACT WITH THE CONDUCTIVE

SLUG. ATTACHING THE SLUG TO A GROUND PLANE WILL REDUCE THE JUNCTION TEMPERATURE OF THE

DEVICE WHICH MAY BE BENEFICIAL IN HIGH TEMPERATURE ENVIRONMENTS.

7°

3.5°

0°

COPLANARITY

0.08

0.20

0.09

Figure 54. 100-Lead Thin Plastic Quad Flat Package, Exposed Pad [TQFP/EP]

(SV-100)

Dimensions shown in millimeters

ORDERING GUIDE

Model

Temperature

Range

Package Description

Package Option

AD9411BSV-170

AD9411BSV-200

–40°C to +85°C

–40°C to +85°C

TQFP/EP

TQFP/EP

SV-100

SV-100

AD9411/PCB

EVALUATION BOARD