ST7260 datasheet(103/117 Pages) STMICROELECTRONICS

部件名	ST7260

功能描述	LOW SPEED USB 8-BIT MCU FAMILY WITH UP TO 8K FLASH/ROM AND SERIAL COMMUNICATION INTERFACE (SCI)

PDF	117 Pages

Scroll/Zoom	100%

制造商	STMICROELECTRONICS [STMicroelectronics]

网页	http://www.st.com

标志

103 / 117 page

ST7260

103/117

14 PACKAGE CHARACTERISTICS

In order to meet environmental requirements, ST

offers these devices in ECOPACK® packages.

These packages have a Lead-free second level in-

terconnect. The category of second Level Inter-

connect is marked on the package and on the in-

ner box label, in compliance with JEDEC Standard

JESD97. The maximum ratings related to solder-

ing conditions are also marked on the inner box la-

bel.

ECOPACK is an ST trademark. ECOPACK speci-

fications are available at: www.st.com

14.1 PACKAGE MECHANICAL DATA

Figure 64. 24-Pin Plastic Small Outline Package, 300-mil Width

Dim.

inches

Min

Typ

Max

Min

Typ

Max

2.35

2.65 0.093

0.104

0.10

0.30 0.004

0.012

0.33

0.51 0.013

0.020

0.23

0.32 0.009

0.013

15.20

15.60 0.599

0.614

7.40

7.60 0.291

0.299

1.27

0.050

10.00

10.65 0.394

0.419

0.25

0.75 0.010

0.030

0°

8°

0°

8°

0.40

1.27 0.016

0.050

Number of Pins

h x 45×

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