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ST7260 数据表(PDF) 106 Page - STMicroelectronics |
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ST7260 数据表(HTML) 106 Page - STMicroelectronics |
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106 / 117 page  ST7260 106/117 14.3 SOLDERING AND GLUEABILITY INFORMATION Recommended soldering information given only as design guidelines in Figure 66 and Figure 67. Recommended glue for SMD plastic packages dedicated to molding compound with silicone: ■ Heraeus: PD945, PD955 ■ Loctite: 3615, 3298 Figure 66. Recommended Wave Soldering Profile (with 37% Sn and 63% Pb) Figure 67. Recommended Reflow Soldering Oven Profile (MID JEDEC) 250 200 150 100 50 0 40 80 120 160 Time [sec] Temp. [°C] 20 60 100 140 5 sec COOLING PHASE (ROOM TEMPERATURE) PREHEATING 80°C PHASE SOLDERING PHASE 250 200 150 100 50 0 100 200 300 400 Time [sec] Temp. [°C] ramp up 2°C/sec for 50sec 90 sec at 125°C 150 sec above 183°C ramp down natural 2°C/sec max Tmax=220+/-5°C for 25 sec |
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