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PCF2104CU/2 数据表(PDF) 49 Page - Motorola, Inc |
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PCF2104CU/2 数据表(HTML) 49 Page - Motorola, Inc |
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49 / 56 page ![]() 1997 Dec 16 49 Philips Semiconductors Product specification LCD controller/driver PCF2104x 18 BONDING PAD LOCATIONS Fig.35 Bonding pad locations. Chip dimensions: approximately 5.10 × 5.63 mm. Gold bump dimensions: approximately 89 × 89 × 25 µm. handbook, full pagewidth PCF2104x ≈ 5.63 mm ≈ 5.10 mm x y 0 0 C35 C36 C37 C38 C39 C40 C41 C42 C43 C44 C45 C46 C48 C49 C47 C50 C51 C23 C24 C25 C26 C27 C28 C29 C31 C32 C30 C33 C34 C52 C53 RS R/W T1 DB7 DB6 DB5 DB4 DB3 DB2 DB1 DB0 SDA VLCD R15 R16 R25 R26 R27 R28 R1 R3 R4 R2 SCL E 1 2 3 4 5 6 7 8 9 10 11 1213 1415 16 1718 19 20 21 22 2324 25 2627 86 59 60 61 62 63 64 65 66 67 68 69 70 71 72 73 74 75 76 77 78 79 80 81 82 83 84 85 28 29 30 31 32 33 34 35 37 38 39 40 41 42 43 44 45 46 47 48 49 50 51 52 53 54 55 56 57 58 36 87 88 89 90 91 92 93 94 95 96 97 98 99 100 101 102 103 104 105 106 107 108 109 110 111 MGC628 |
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