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ADRF5347BCCZN-R7 数据表(PDF) 5 Page - Analog Devices

部件名 ADRF5347BCCZN-R7
功能描述  High Linearity, Silicon SP4T Switch, 1.8 GHz to 3.8 GHz
PDF  15 Pages
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制造商  AD [Analog Devices]
网页  http://www.analog.com
标志 AD - Analog Devices

ADRF5347BCCZN-R7 数据表(HTML) 5 Page - Analog Devices

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Data Sheet
ADRF5347
ABSOLUTE MAXIMUM RATINGS
analog.com
Rev. 0 | 5 of 15
Table 2.
Parameter
Rating
VDD
–0.3 V to +5.5 V
VSS
–3.8 V to +0.3 V
VCTL
–0.3 V to +3.6 V
RFC, RF1, RF2, RF3, RF4
–2.0 V to +2.0 V
RF Input Power1 (TCASE = 105°C)
Through Power
Average
40.5 dBm
Peak
50.5 dBm
Reflected Power
Average
32.5 dBm
Peak
40.5 dBm
Hot Switching Power
Average
39.5 dBm
Peak
49.5 dBm
Temperature
Junction to Maintain 0.6 Million Hours Mean
Time to Failure 2 (MTTF)
135°C
Storage
–65°C to +150°C
Reflow
260°C
1 For recommended operating conditions, see Table 1.
2 For 55°C paddle temperature and incident RF power of 37 dBm(avg)/47
dBm(peak) LTE, FIT rate is 17.7. This FIT rate is not degraded under 7.88e9
hot switching at 10 years lifetime.
Stresses at or above those listed under Absolute Maximum Ratings
may cause permanent damage to the product. This is a stress
rating only; functional operation of the product at these or any other
conditions above those indicated in the operational section of this
specification is not implied. Operation beyond the maximum operat-
ing conditions for extended periods may affect product reliability.
THERMAL RESISTANCE
Thermal performance is directly linked to printed circuit board
(PCB) design and operating environment. Careful attention to PCB
thermal design is required.
Table 3. Thermal Resistance
Package Type
θJC1
Unit
CC-20-14
37
°C/W
1 θJC is the junction to case bottom (channel to package bottom) thermal
resistance. θJC is determined by simulation under the following conditions:
the heat transfer is due solely to the thermal conduction from the channel
through the ground pad to the PCB, and the ground pad is held constant at the
operating temperature of 105°C.
ELECTROSTATIC DISCHARGE (ESD) RATINGS
The following ESD information is provided for handling of ESD-sen-
sitive devices in an ESD protected area only.
Human body model (HBM) per ANSI/ESDA/JEDEC JS-001.
Charged device model (CDM) per ANSI/ESDA/JEDEC JS-002.
ESD Ratings for the ADRF5347
Table 4. ADRF5347, 20-Terminal LGA
ESD Model
Withstand Threshold (V)
Class
HBM
1000
1B
CDM
750
C4
ESD CAUTION
ESD (electrostatic discharge) sensitive device. Charged devi-
ces and circuit boards can discharge without detection. Although
this product features patented or proprietary protection circuitry,
damage may occur on devices subjected to high energy ESD.
Therefore, proper ESD precautions should be taken to avoid
performance degradation or loss of functionality.



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