Preliminary Data Sheet

AD8196

PrA | Page 5 of 24

ABSOLUTE MAXIMUM RATINGS

Table 2.

Parameter

Rating

AVCC to AVEE

3.7 V

DVCC to DVEE

3.7 V

DVEE to AVEE

±0.3 V

VTTI

AVCC + 0.6 V

VTTO

AVCC + 0.6 V

AMUXVCC

5.5 V

Internal Power Dissipation

4.62 W

High Speed Input Voltage

High Speed Differential

Input Voltage

2.0 V

Low Speed Input Voltage

Storage Temperature

Range

−65°C to +125°C

Operating Temperature

Range

−40°C to +85°C

Junction Temperature

150°C

Stresses above those listed under Absolute Maximum Ratings

may cause permanent damage to the device. This is a stress

rating only; functional operation of the device at these or any

other conditions above those indicated in the operational

section of this specification is not implied. Exposure to absolute

maximum rating conditions for extended periods may affect

device reliability.

THERMAL RESISTANCE

θ

JA

is specified for the worst-case conditions: a device soldered

in a 4-layer JEDEC circuit board for surface-mount packages.

θ

JC

is specified for the exposed pad soldered to the circuit board

with no airflow.

Table 3. Thermal Resistance

Package Type

θ

JA

θ

JC

Unit

56-Lead LFCSP

27

2.1

°C/W

MAXIMUM POWER DISSIPATION

The maximum power that can be safely dissipated by the

AD8196 is limited by the associated rise in junction tempera-

ture. The maximum safe junction temperature for plastic

encapsulated devices is determined by the glass transition

temperature of the plastic, approximately 150°C. Temporarily

exceeding this limit may cause a shift in parametric performance

due to a change in the stresses exerted on the die by the package.

Exceeding a junction temperature of 175°C for an extended

period can result in device failure. To ensure proper operation,

it is necessary to observe the maximum power derating as

determined by the coefficients in Table 3.

ESD CAUTION

ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily accumulate on

the human body and test equipment and can discharge without detection. Although this product features

proprietary ESD protection circuitry, permanent damage may occur on devices subjected to high energy

electrostatic discharges. Therefore, proper ESD precautions are recommended to avoid performance

degradation or loss of functionality.