ADT7408

Rev. 0 | Page 5 of 24

ABSOLUTE MAXIMUM RATINGS

Table 3.

Parameter

Rating

–0.3 V to +7 V

Operating Temperature Range

–55°C to +150°C

Storage Temperature Range

–65°C to +160°C

150°C

Thermal Resistance1

IR Reflow Soldering Profile

Refer to Figure 3

temperature. Thermal resistance value relates to the package being used on

a standard 2-layer PCB, which gives a worst-case

publish junction-to-case thermal resistance

that is mounted on an ideal heat sink. As a result, junction-to-ambient

thermal resistance is more practical for air-cooled, PCB-mounted

components.

Stresses above those listed under Absolute Maximum Ratings

may cause permanent damage to the device. This is a stress

rating only; functional operation of the device at these or any

other conditions above those indicated in the operational

section of this specification is not implied. Exposure to absolute

maximum rating conditions for extended periods may affect

device reliability.

480 SECONDS MAX.

60 – 180 SECONDS

20 – 40 SECONDS

TIME (Seconds)

260 – 5/+0°C

150°C – 200°C

RAMP DOWN

6°C/SECOND

MAX.

217°C

RAMP UP

3°C/SECOND MAX

60 – 150 SECONDS

Figure

3. LFCSP Pb-Free Reflow Profile Based on JEDEC J-STD-20C

ESD CAUTION

ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily accumulate on

the human body and test equipment and can discharge without detection. Although this product features

proprietary ESD protection circuitry, permanent damage may occur on devices subjected to high energy

electrostatic discharges. Therefore, proper ESD precautions are recommended to avoid performance degrada-

tion or loss of functionality.