Preliminary Technical Data

AD5522

Rev. PrL | Page 11 of 45

ABSOLUTE MAXIMUM RATINGS

Table 3. AD5522 Absolute Maximum Ratings

Parameter

Rating

34V

-0.3V to 34V

0.3V to -34V

-0.3 V, +7V

DUTGND, REFGND, AGND

- 0.3V to 7V

Digital Inputs to DGND

Analog Inputs to AGND

Storage Temperature

–65°C to +125°C

Operating Junction Temperature

+25 to +90°C

Reflow Soldering

Peak Temperature

230°C

Time at Peak Temperature

10s to 40s

Junction Temperature

150°C max

Stresses above those listed under Absolute Maximum Ratings

may cause permanent damage to the device. This is a stress

rating only and functional operation of the device at these or

any other condition s above those indicated in the operational

section of this specification is not implied. Exposure to absolute

maximum rating conditions for extended periods may affect

device reliability.

Thermal resistance values are specified for the worst-case

conditions, i.e., specified for device soldered in circuit board for

surface mount packages.

Table 4. Thermal Resistance (JEDEC 4 layer (1S2P) board)

Air Flow (LFPM)

0

200

500

Unit

TQFP Exposed Pad Down

θ

JA

22.3

17.2

15.1

°C/W

θ

JC

0.3

°C/W

TQFP Exposed Pad Up

θ

JA

TBD

TBD

TBD

°C/W

θ

JC

4.8

°C/W

Table 5. Thermal Resistance (JEDEC 4 layer (1S2P) board

ambient)

Package Thermals

θ

JA

θ

JA

Unit

TQFP Exposed Pad Down

5.4

4.8

°C/W

TQFP Exposed Pad Up

3.0

0.3

°C/W

paddle

ESD CAUTION

ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily accumulate on the

human body and test equipment and can discharge without detection. Although this product features

proprietary ESD protection circuitry, permanent damage may occur on devices subjected to high energy

electrostatic discharges. Therefore, proper ESD precautions are recommended to avoid performance

degradation or loss of functionality.