GWIXP425BDT datasheet(50/134 Pages) INTEL

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Intel® IXP42X Product Line of Network Processors and IXC1100 Control Plane Processor

March 2005

Datasheet

Document Number: 252479, Revision: 005

4.0

Package and Pinout Information

The Intel® IXP42X Product Line of Network Processors and IXC1100 Control Plane Processor

have a 492-ball, plastic ball grid array (PBGA) package for commercial-temperature applications

and a pin-for-pin, compatible 492-ball, plastic ball grid array with a drop-in heat spreader (H) for

extended-temperature applications.

4.1

Package Description

Figure 7.

492-Pin Lead PBGA Package

All measurements are in millimeters (mm).

The size of the land pad at the interposer side (1) is 0.81 mm.

The size of the solder resist at the interposer side (2) is 0.66 mm.

B1268-03

0.60 ± 0.10

Seating Plane

30º

1.17 ± 0.05

2.38 ± 0.21

0.61 ± 0.06

0.15

0.20

-C-

SIDE VIEW

Pin #1

Corner

1.27

1.63 REF

1.27

ø 0.30

B S

ø1.0

3 Places

+ +

1.63 REF

0.90

0.60

22.00 REF

35.00 ± 0.20

30.00 ± 0.25

Pin 1 ID

30.00 ± 0.25

45º Chamfer

4 Places

0.127 A

-B-

-A-

TOP VIEW

(1)

(2)

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