Table of Contents

Scope............................................................................................................................................................. 1

Introduction.....................................................................................................................................................1

Reference Documents....................................................................................................................................1

1.

Features.................................................................................................................................................. 3

2.

Applications.............................................................................................................................................5

3.

Block Diagram.........................................................................................................................................6

4.

Chip Identifier.......................................................................................................................................... 7

5.

Package and Ballout............................................................................................................................... 8

5.1.

Packages......................................................................................................................................8

5.2.

Ballout.......................................................................................................................................... 8

5.3.

Recommended SAMG55-PL360 Connection.............................................................................10

6.

Electrical Characteristics....................................................................................................................... 11

6.1.

Decoupling..................................................................................................................................11

6.2.

Power Sequences...................................................................................................................... 11

6.3.

Thermal Characteristics..............................................................................................................11

6.4.

Power Consumption................................................................................................................... 11

7.

Mechanical Characteristics................................................................................................................... 12

7.1.

121-Ball TFBGA......................................................................................................................... 12

8.

Recommended Mounting Conditions.................................................................................................... 16

9.

Marking................................................................................................................................................. 17

10. Ordering Information............................................................................................................................. 18

11. Revision History.................................................................................................................................... 19

11.1. Rev A - 12/2019......................................................................................................................... 19

11.2. Rev B - 03/2020......................................................................................................................... 19

The Microchip Website.................................................................................................................................20

Product Change Notification Service............................................................................................................20

Customer Support........................................................................................................................................ 20

Microchip Devices Code Protection Feature................................................................................................ 20

Legal Notice................................................................................................................................................. 20

Trademarks.................................................................................................................................................. 21

Quality Management System....................................................................................................................... 21

Worldwide Sales and Service.......................................................................................................................22

© 2020 Microchip Technology Inc.

Datasheet

60001600B-page 2