5.

Package and Ballout

5.1

Packages

The PL485 is available in the packages listed in the following table:

Table 5-1. PL485 Packages

Package Name

Ball Count

Ball Pitch

Package Size

TFBGA121

121

0.80 mm

10 x 10 mm2

5.2

Ballout

Table 5-2. PL485 Ballout

A1

GND

C3

GND

E5

PL_PA0

G7

PA30

J9

PA14

A2

PL_VZC

C4

GND

E6

PL_PA3

G8

PB10

J10

PA13

A3

PL_PA1

C5

GND

E7

PL_PA8/MOSI

G9

PA9

J11

PA12

A4

VDDIO

C6

AGND

E8

PL_PA9/MISO

G10

PB5

K1

PA1

A5

VDDIN_AN

C7

GND

E9

VDDIO

G11

PB8/XOUT

K2

PA5

A6

PL_VREFC

C8

GND

E10

VDDIO

H1

PA0

K3

PA8

A7

PL_VIN

C9

GND

E11

VDDIO

H2

PA2

K4

PA16

A8

AGND

C10

PL_EMIT3

F1

PA31

H3

MCU_NRST

K5

VDDIO

A9

PL_TXRX0

C11

PL_EMIT2

F2

PB15

H4

MCU_TST

K6

PA22

A10

PL_TXRX1

D1

PL_VDDCORE

F3

PA25

H5

VDDIO

K7

ADVREF

A11

GND

D2

PL_PA4/SWDIO

F4

PB13

H6

GND

K8

PA18

B1

PL_XOUT

D3

PL_PA2/TRACESWO

F5

PA24

H7

GND

K9

PA20

B2

PL_XIN

D4

PL_NRST

F6

PA26

H8

PA19

K10

PB0

B3

GND

D5

GND

F7

PA28

H9

PB11

K11

PB3

B4

VDDIO

D6

GND

F8

PA27

H10

PA11

L1

GND

B5

AGND

D7

GND

F9

PB7

H11

PA10

L2

MCU_VDDCORE

B6

PL_VREFN

D8

GND

F10

PB6

J1

PA4

L3

PA6

B7

PL_VREFP

D9

VDDIO

F11

PB9/XIN

J2

PA3

L4

PA15

B8

VDDIN_AN

D10

PL_EMIT1

G1

PB14

J3

PA7

L5

PA23

B9

PL_AGC

D11

PL_EMIT0

G2

PB4

J4

PB12

L6

PA21

B10

VDDIO

E1

VDDIN

G3

JTAGSEL

J5

VDDIO

L7

VDDOUT

B11

PL_VDDCORE

E2

PL_PA5/SWCLK

G4

PL_PA7/SPCK

J6

GND

L8

PB1

C1

VDDPLL

E3

PL_TST

G5

PA29

J7

VDDUSB

L9

PB2

C2

VDDPLL

E4

PL_LDO_ENABLE

G6

PL_PA6/NPCS0

J8

PA17

L10

MCU_VDDCORE

L11

GND

Package and Ballout

© 2020 Microchip Technology Inc.

Datasheet

60001600B-page 8