6.

Electrical Characteristics

Please refer to PL360 and SAM G55J Datasheets for specific information about Electrical Characteristics.

6.1

Decoupling

For correct PLC transmission, a 4.7 µF decoupling capacitor must be added to each of the following VDDIO balls: D9,

E9, E10 and E11.

Please refer to the reference datasheets for other Decoupling Requirements.

6.2

Power Sequences

Please refer to the reference datasheets for Power Sequences Considerations.

6.3

Thermal Characteristics

Table 6-1. Thermal Resistance Data

Symbol

Parameter

Condition

Typ

Unit

θJA

Junction-to-ambient thermal resistance

Still Air

31.1

ºC/W

1m/s

21.9

2m/s

19.6

ΨJC

Junction-to-top center of package thermal characterization

-

1.9

θJA is calculated based on a standard JEDEC JESD51-5 defined environment (1.6mm thickness PCB, 4 copper

layers, 76.2mm x 114.3mm board) and is not reliable indicator of a device’s thermal performance in a non-JEDEC

environment. The customer should always perform their own calculations/simulations to ensure that their system’s

thermal performance is sufficient.

6.4

Power Consumption

Please refer to the reference datasheets for Power Consumption.

Electrical Characteristics

© 2020 Microchip Technology Inc.

Datasheet

60001600B-page 11