RECOMMENDED LAND PATTERN

Dimension Limits

Units

C2

Contact Pad Spacing

Contact Pitch

MILLIMETERS

0.80 BSC

MIN

E

MAX

8.00

Contact Pad Diameter (X121)

X

0.40

Microchip Technology Drawing C04-3216A

NOM

121-Ball Thin, Fine Pitch Ball Grid Array (AJA) - 10x10 mm Body [TFBGA]

C1

Contact Pad Spacing

8.00

BSC: Basic Dimension. Theoretically exact value shown without tolerances.

Notes:

Dimensioning and tolerancing per ASME Y14.5M

1.

For the most current package drawings, please see the Microchip Packaging Specification located at

http://www.microchip.com/packaging

Note:

C1

C2

E

ØX

L

K

J

H

G

F

E

D

C

B

A

1

2

3

4

5

6

7

8

9

10

11

SILK SCREEN

E

Mechanical Characteristics

© 2020 Microchip Technology Inc.

Datasheet

60001600B-page 14