Microchip Technology Drawing C04-1216A Sheet 2 of 2

REF: Reference Dimension, usually without tolerance, for information purposes only.

BSC: Basic Dimension. Theoretically exact value shown without tolerances.

1.

2.

Notes:

Terminal A1 visual index feature may vary, but must be located within the hatched area.

Dimensioning and tolerancing per ASME Y14.5M

121-Ball Thin, Fine Pitch Ball Grid Array (AJA) - 10x10 mm Body [TFBGA]

For the most current package drawings, please see the Microchip Packaging Specification located at

http://www.microchip.com/packaging

Note:

Number of Terminals

Overall Height

Terminal Width

Overall Width

Substrate Thickness

Pitch

Terminal (ball) height

Units

Dimension Limits

A1

A

b

S

e

E

N

0.80 BSC

0.26 REF

0.38

-

0.270

0.40

-

-

10.00 BSC

MILLIMETERS

MIN

NOM

121

0.48

1.20

0.37

MAX

Overall Length

D

10.00 BSC

Mold Cap Thickness

M

0.53 REF

Mechanical Characteristics

© 2020 Microchip Technology Inc.

Datasheet

60001600B-page 13