9

Suggested footprint

The MASTERGAN2 footprint for the PCB layout is usually defined based on several design factors such as

assembly plant technology capabilities and board component density. For easy device usage and evaluation, ST

provides the following footprint design, which is suitable for the largest variety of PCBs.

The following footprint indicates the copper area that should be free of solder mask, and shall extend beyond the

indicated areas, especially for EP2 and EP3. To aid thermal dissipation, it is recommended to add thermal vias

under these EPADs to transfer and dissipate device heat to the other PCB copper layers. A PCB layout example

is available with the MASTERGAN2 evaluation board.

Figure 31. Suggested footprint (top view drawing)

TOP VIEW

Dimensions in mm

MASTERGAN2

Suggested footprint

DS13597 - Rev 2.0

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