M34C02-R datasheet(30/31 Pages) STMICROELECTRONICS

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Revision history

M34C02-W, M34C02-L, M34C02-R

30/31

Revision history

Table 18.

Document revision history

Date

Revision

Description of Revision

27-Dec-1999

2.0

Adjustments to the formatting. 0 to 70°C temperature range removed from

DC and AC tables.

No change to description of device, or parameters

07-Dec-2000

2.1

New definition of lead soldering temperature absolute rating for certain

packages

13-Mar-2001

2.2

-R voltage range added

18-Jul-2002

2.3

TSSOP8 (3x3mm² body size) package (MSOP8) added

22-May-2002

2.4

VFDFPN8 package (MLP8) added

21-Jul-2003

3.0

Document reformatted. -F voltage range added.

17-Mar-2004

4.0

Table of Contents added. MLP package changed. Absolute Maximum

Ratings for VIO(min) and VCC(min) changed. Soldering temperature

information clarified for RoHS compliant devices. Device grade information

clarified

14-Apr-2004

5.0

Typos corrected in Ordering Information example

26-Aug-2004

6.0

Device Grade clarified. Product List summary table added

30-Nov-2004

7.0

SO8 package removed.

14-Oct-2005

8.0

M34C02-R operating frequency upgraded to 400 kHz. Modified

Section 1.1: Device Internal Reset, Figure 4: Maximum RP value versus

bus parasitic capacitance (C) for an I²C Bus, Table 10: Input Parameters,

ICC1 values in Table 11: DC Characteristics (M34C02-W), Table 13: DC

Characteristics (M34C02-R), Table 15: DC Characteristics (M34C02-W-F)

and moved M34C02-R to Table 14: AC Characteristics M34C02-W,

M34C02-L, M34C02-R). Added Figure 3: Chip Enable input connection.

Added EcoPack® and Ambient Operating Temperature information.

11-Apr-2006

BN and DS (PDIP and TSSOP8) packages removed..

M34C02-F part number removed.

Test Conditions modified for ICC1 and VOL in Table 11: DC Characteristics

(M34C02-W).

Device Internal Reset removed and replaced by Section 2.5: Supply

voltage (VCC).

Blank option removed below Plating Technology in Table 17.

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