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RT6310C/CH 数据表(PDF) 44 Page - Richtek Technology Corporation |
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RT6310C/CH 数据表(HTML) 44 Page - Richtek Technology Corporation |
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44 / 54 page ![]() RT6310 Copyright © 2023 Richtek Technology Corporation. All rights reserved. is a registered trademark of Richtek Technology Corporation. www.richtek.com DS6310-04 August 2023 44 Figure 20. De-rating Curve of Maximum Power Dissipation Layout Considerations Printed circuit board (PCB) layout design for switch- mode power supply IC is critical and important. Improper PCB layout brings lots of problems on power supply, such as poor output voltage regulation, switching jitter, bad thermal performance, excessively radiate noise and reducing component reliability. To avoid those issues, designers have to understand current trace and signal flow in the switching power supply. The following are design considerations of PCB layout for switching power supply. For suppressing phase ring and extra power losses that affect device reliability, the input capacitor has to be placed close to VIN pin to reduce the influence of parasitic inductor. For thermal stress and power consumption considerations, the current paths of VIN and VOUT has to be as short and wide as possible to decrease the trace impedance. Since the LX node voltage swings from VIN to 0V with very fast rising and falling times, switching power supply suffers quite serious EMI issues. To eliminate EMI problems, the inductor must be put as close as possible to IC to narrow the LX node area. Besides, the LX node should be arranged in the same plate to reduce coupling noise path caused by parasitic capacitance. For system stability and coupling noise elimination, the sensitive components and signals, such as control signal and feedback loop, should be kept away from LX node. For enhancing noise immunity on VCC pin, the decoupling capacitor must be connected from VCC to AGND, and the capacitor should be placed close to IC. The feedback signal path from VOUT to IC should be wide and kept away from high switching path. The trace width and numbers of via should be designed based on application current. Make sure the switching power supply has great thermal performance and good efficiency. An example of PCB layout guides are shown in Figure 21 to Figure 23 for reference. 0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 0 25 50 75 100 125 Ambient Temperature (°C) four-layer Richtek EVB |
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