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VCTA25201B-R33MS6 数据表(PDF) 4 Page - Richtek Technology Corporation |
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VCTA25201B-R33MS6 数据表(HTML) 4 Page - Richtek Technology Corporation |
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4 / 50 page ![]() RTQ2134-QA Copyright © 2022 Richtek Technology Corporation. All rights reserved. is a registered trademark of Richtek Technology Corporation. www.richtek.com DSQ2134-QA-02 May 2022 4 Pin No. Pin Name Pin Function 15 WDOG_RST Control input for output voltage reset. Reset each Buck output voltage, DVSx, and ENDVSx registers to factory default setting value when this pin is pulled low. Connect this pin to be higher than 70% of VIO pin voltage if this pin is not used. "Do Not" leave this pin floating. The minimum watchdog debounce time is 100 s. Note that the factory default setting value in watchdog register (0x25) is 0x00h (Disabled). 16 PVIN3 Power input for power stage 3. It is recommended to use a 10- F, X7R capacitor. 18 LX3 Switching node for power stage 3. 20 LX2 Switching node for power stage 2. 22 PVIN2 Power input for power stage 2. It is recommended to use a 10- F, X7R capacitor. 23 SCL Clock input for I2C interface. The pull-up voltage supply must be the same as VIO voltage for correct operation. Connect this pin to AGND if I2C interface is not used. "Do Not" leave this pin floating. 24 SDA Data line for I2C interface. The pull-up voltage supply must be the same as VIO voltage for correct operation. Connect this pin to AGND if I2C interface is not used. "Do Not" leave this pin floating. 25 INT Interrupt indicator. When INT function is used, set 0x33[6] = 1, 0x34[6] = 1 and 0x35[6] = 1. 26 VIO I/O supply voltage for digital communications. Connect this pin to 1.8V for normal operation. "Do Not" leave this pin floating. 27 EN Master chip enable. A logic-high enables the converter; a logic-low forces the device into shutdown mode. "Do Not" leave this pin floating. 28 VOUT2 Output voltage sense for Buck2. 29 RTN2 Remote ground sense for Buck2. 30 AVIN Analog input voltage. 31(Exposed PAD) PGND Exposed pad. The exposed pad is connected to PGND and must be soldered to a large PCB copper area for maximum power dissipation. |
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