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VCTA25201B-R33MS6 数据表(PDF) 22 Page - Richtek Technology Corporation |
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VCTA25201B-R33MS6 数据表(HTML) 22 Page - Richtek Technology Corporation |
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22 / 50 page ![]() RTQ2134-QA Copyright © 2022 Richtek Technology Corporation. All rights reserved. is a registered trademark of Richtek Technology Corporation. www.richtek.com DSQ2134-QA-02 May 2022 22 Place high frequency decoupling capacitor as close as possible to the IC to reduce the loop impedance and minimize switch node ringing. Place multiple vias under the device near PVIN and PGND and close to input capacitors to reduce parasitic inductance and improve thermal performance. To keep thermal resistance low, extend the ground plane as much as possible, and add twenty thermal vias under and near the RTQ2134 to additional ground planes within the circuit board and on the bottom side. The high frequency switching nodes, LX, should be as small as possible. Keep analog components away from the LX node. Reduce the area size of the LX exposed copper to reduce the electrically coupling from this voltage. Connect the feedback sense network behind via of output capacitor. Connect all analog grounds to common node and then connect the common node to the power ground with a single point. Figure 9 and Figure 10 show the layout example which includes one two phase converter for Core and one single phase converter for Memory application. CIN4 CIN1 PVIN4 LX4 PVIN1 LX1 I 2C CVIO CIN2 CIN3 L2 L3 COUT2_0 COUT3_0 COUT3_1 31 PAD 4 3 5 2 1 6 7 11 19 20 18 21 22 17 16 12 10 9 8 15 14 13 27 26 28 29 30 23 24 25 PVIN2 LX2 PGND PVIN3 LX3 COUT2_1 L4 L1 COUT4_1 COUT1_1 COUT4_0 CAVIN COUT1_0 PGND Connect to PGND in second layer with single node. Keep feedback sense trace away from noise trace to reduce coupling. AVIN_FILT capacitor must be placed as close to IC as possible Add vias on exposed pad for thermal dissipation and current carrying capacity Input capacitors must be placed as close to IC VIN-GND as possible Connect to PGND in second layer with single node. VOUT1 VOUT2 VOUT3 Figure 9 . Layout Guideline for 2 + 1 + 1 Application |
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