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VCTA25201B-R33MS6 数据表(PDF) 22 Page - Richtek Technology Corporation

部件名 VCTA25201B-R33MS6
功能描述  2.1MHz, 20A Multi-Phase Step-Down Converter with I2C Interface
PDF  50 Pages
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制造商  RICHTEK [Richtek Technology Corporation]
网页  http://www.richtek.com
标志 RICHTEK - Richtek Technology Corporation

VCTA25201B-R33MS6 数据表(HTML) 22 Page - Richtek Technology Corporation

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RTQ2134-QA
Copyright © 2022 Richtek Technology Corporation. All rights reserved.
is a registered trademark of Richtek Technology Corporation.
www.richtek.com
DSQ2134-QA-02
May
2022
22
Place high frequency decoupling capacitor as close
as possible to the IC to reduce the loop impedance
and minimize switch node ringing.
Place multiple vias under the device near PVIN and
PGND and close to input capacitors to reduce
parasitic
inductance
and
improve
thermal
performance. To keep thermal resistance low,
extend the ground plane as much as possible, and
add twenty thermal vias under and near the
RTQ2134 to additional ground planes within the
circuit board and on the bottom side.
The high frequency switching nodes, LX, should be
as small as possible. Keep analog components
away from the LX node.
Reduce the area size of the LX exposed copper to
reduce the electrically coupling from this voltage.
Connect the feedback sense network behind via of
output capacitor.
Connect all analog grounds to common node and
then connect the common node to the power ground
with a single point.
Figure 9 and Figure 10 show the layout example which
includes one two phase converter for Core and one
single phase converter for Memory application.
CIN4
CIN1
PVIN4
LX4
PVIN1
LX1
I
2C
CVIO
CIN2
CIN3
L2
L3
COUT2_0
COUT3_0
COUT3_1
31
PAD
4
3
5
2
1
6
7
11
19
20
18
21
22
17
16
12
10
9
8
15
14
13
27
26
28
29
30
23
24
25
PVIN2
LX2
PGND
PVIN3
LX3
COUT2_1
L4
L1
COUT4_1
COUT1_1
COUT4_0
CAVIN
COUT1_0
PGND
Connect to PGND in
second layer with
single node.
Keep feedback sense
trace away from noise
trace to reduce coupling.
AVIN_FILT capacitor
must be placed as close
to IC as possible
Add vias on exposed pad
for thermal dissipation and
current carrying capacity
Input capacitors must be
placed as close to IC
VIN-GND as possible
Connect to PGND in
second layer with
single node.
VOUT1
VOUT2
VOUT3
Figure 9
. Layout Guideline for 2 + 1 + 1 Application



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