ADA4351-2ACPZ-R7 datasheet(8/36 Pages) AD

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Data Sheet

ADA4351-2

ABSOLUTE MAXIMUM RATINGS

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Table 3. Absolute Maximum Ratings

Parameter

Rating

Voltage Between Any Two Pins

6 V

DVDD and AVDD to DVSS

−0.3 V to +6 V

DVDD, AVDD, and DVSS to AVSS

−0.3 V to +6 V

+IN and −IN Voltage

AVSS − 1 V to AVDD + 1 V

+IN and −IN Current

10 mA

SW0 and SW1 Voltage

AVSS − 0.3 V to AVDD + 0.3 V

SW SEL Voltage

DVSS − 0.3 V to DVDD + 0.3 V

SW SEL Current

10 mA

Op Amp Output Continuous Current

±20 mA1, electromigration limited

Switch Continuous Current

±20 mA1, electromigration limited

Temperature

Storage Range

−65°C to +150°C

Operating Range

−40°C to +125°C

Junction, TJ

150°C

Case, TC

260°C

1 Specified at 100°C. See the derating curve for temperatures beyond 100°C

(see Figure 4).

Stresses at or above those listed under Absolute Maximum Ratings

may cause permanent damage to the product. This is a stress

rating only; functional operation of the product at these or any other

conditions above those indicated in the operational section of this

specification is not implied. Operation beyond the maximum operat-

ing conditions for extended periods may affect product reliability.

THERMAL RESISTANCE

Thermal performance is directly linked to PCB design and operating

environment. Careful attention to PCB thermal design is required.

θJA is the natural convection junction-to-ambient thermal resistance

measured in a one cubic foot sealed enclosure.

Table 4. Thermal Resistance

Package Type

θJA

Unit

CP-16-32

°C/W

MAXIMUM POWER DISSIPATION

The maximum safe power dissipation for the ADA4351-2 is limited

by the associated rise in TJ on the die. At approximately 150°C,

which is the glass transition temperature, the properties of the plas-

tic change. Even temporarily exceeding this temperature limit may

change the stresses the package exerts on the die, permanently

shifting the parametric performance of the ADA4351-2. Exceeding a

TJ of 175°C for an extended period can result in changes in the sili-

con devices, potentially causing degradation or loss of functionality.

The power dissipated in the package is the sum of the quiescent

power dissipation and the power dissipated in the die due to the

output load drive of the amplifier.

OUTPUT CURRENT DERATING CURVE

Figure 4. Maximum Output Current Derating Curve vs. Temperature

EXPLANATION OF TEST LEVELS

Table 5. Explanation of Test Levels

Test Level

Description

Definition

Design verification simulation

100% production tested

Functionally checked during production test

Characterized on tester

Characterized on bench

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