52

Am29DL640D

December 13, 2005

Revision C (January 10, 2003)

Package Options

Removed the 64-ball Fortified BGA package and

pinout.

Sector/Sector Block Protection and Unprotection

Change wording of first sentence of third paragraph.

Customer Lockable: SecSi Sector NOT

Programmed or Protected at the factory.

Added second bullet, SecSi sector-protect verify text

and figure 3.

SecSi Sector Flash Memory Region, and Enter

SecSi Sector/Exit SecSi Sector Command

Sequence

Noted that the ACC function and unlock bypass modes

are not available when the SecSi sector is enabled.

Byte/Word Program Command Sequence, Sector

Erase Command Sequence, and Chip Erase Com-

mand Sequence

Noted that the SecSi Sector, autoselect, and CFI

functions are unavailable when a program or erase

operation is in progress.

Common Flash Memory Interface (CFI)

Changed CFI website address.

Revision C+1 (October 7, 2004)

Cover Sheet and Title Page

Added notation to superseding documents.

Revision C+2 (January 11, 2005)

Ordering Information and Valid Combinations

Added Pb-free package options.

Updated cross-references.

Changed SecSi™ to Selected Silicon

Removed Sales Office Listing

Revision C+3 (December 13, 2005)

This product has been retired and is not available for

designs. Availability of this document is retained for

reference and historical purposes only.

Colophon

The products described in this document are designed, developed and manufactured as contemplated for general use, including without limita-

tion, ordinary industrial use, general office use, personal use, and household use, but are not designed, developed and manufactured as con-

templated (1) for any use that includes fatal risks or dangers that, unless extremely high safety is secured, could have a serious effect to the

public, and could lead directly to death, personal injury, severe physical damage or other loss (i.e., nuclear reaction control in nuclear facility,

aircraft flight control, air traffic control, mass transport control, medical life support system, missile launch control in weapon system), or (2) for

any use where chance of failure is intolerable (i.e., submersible repeater and artificial satellite). Please note that Spansion will not be liable to

you and/or any third party for any claims or damages arising in connection with above-mentioned uses of the products. Any semiconductor de-

vices have an inherent chance of failure. You must protect against injury, damage or loss from such failures by incorporating safety design mea-

sures into your facility and equipment such as redundancy, fire protection, and prevention of over-current levels and other abnormal operating

conditions. If any products described in this document represent goods or technologies subject to certain restrictions on export under the Foreign

Exchange and Foreign Trade Law of Japan, the US Export Administration Regulations or the applicable laws of any other country, the prior au-

thorization by the respective government entity will be required for export of those products.

Trademarks

Copyright © 2001 – 2005 Advanced Micro Devices, Inc. All rights reserved.

AMD, the AMD logo, and combinations thereof are registered trademarks of Advanced Micro Devices, Inc.

ExpressFlash is a trademark of Advanced Micro Devices, Inc.

Product names used in this publication are for identification purposes only and may be trademarks of their respective companies.