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PCF8548U/2 数据表(PDF) 31 Page - NXP Semiconductors |
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PCF8548U/2 数据表(HTML) 31 Page - NXP Semiconductors |
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31 / 40 page  1999 Aug 16 31 Philips Semiconductors Product specification 65 × 102 pixels matrix LCD driver PCF8548 Table 8 Bonding pad location All x and y coordinates are referenced to the centre of the chip (dimension in µm; see Fig.22). SYMBOL PAD x y RES 1 +1160 +899.4 SDAOUT 2 +840 +899.4 SDAIN 3 +600 +899.4 SDAIN 4 +520 +899.4 SCL 5 +200 +899.4 SCL 6 +120 +899.4 T2 7 −200 +899.4 SA0 8 −410 +899.4 T7 9 −620 +899.4 T6 10 −830 +899.4 T5 11 −1040 +899.4 T4 12 −1250 +899.4 T3 13 −1460 +899.4 T1 14 −1670 +899.4 VSS1 15 −1750 +899.4 VSS1 16 −1830 +899.4 VSS1 17 −1910 +899.4 VSS1 18 −1990 +899.4 VSS1 19 −2070 +899.4 VSS1 20 −2150 +899.4 VSS2 21 −2310 +899.4 VSS2 22 −2390 +899.4 VSS2 23 −2470 +899.4 VSS2 24 −2550 +899.4 VSS2 25 −2630 +899.4 VSS2 26 −2710 +899.4 dummy pad 27 −2790 +899.4 VLCDOUT 28 −2950 +899.4 VLCDOUT 29 −3030 +899.4 VLCDOUT 30 −3110 +899.4 VLCDOUT 31 −3190 +899.4 VLCDOUT 32 −3270 +899.4 VLCDOUT 33 −3350 +899.4 VLCDSENSE 34 −3430 +899.4 VLCDIN 35 −3510 +899.4 VLCDIN 36 −3590 +899.4 VLCDIN 37 −3670 +899.4 VLCDIN 38 −3750 +899.4 VLCDIN 39 −3830 +899.4 VLCDIN 40 −3910 +899.4 R32 41 −4235 +899.4 R31 42 −4305 +899.4 R30 43 −4375 +899.4 R29 44 −4445 +899.4 R28 45 −4515 +899.4 R27 46 −4585 +899.4 R26 47 −4655 +899.4 R25 48 −4725 +899.4 R24 49 −4795 +899.4 R23 50 −4865 +899.4 R22 51 −4935 +899.4 R21 52 −5005 +899.4 R20 53 −5075 +899.4 R19 54 −5145 +899.4 dummy pad 55 −5355 +899.4 dummy pad 56 −5320 −899.4 R0 57 −5040 −899.4 R1 58 −4970 −899.4 R2 59 −4900 −899.4 R3 60 −4830 −899.4 R4 61 −4760 −899.4 R5 62 −4690 −899.4 R6 63 −4620 −899.4 R7 64 −4550 −899.4 R8 65 −4480 −899.4 R9 66 −4410 −899.4 R10 67 −4340 −899.4 R11 68 −4270 −899.4 R12 69 −4200 −899.4 R13 70 −4130 −899.4 R14 71 −4060 −899.4 R15 72 −3990 −899.4 R16 73 −3920 −899.4 R17 74 −3850 −899.4 R18 75 −3780 −899.4 C0 76 −3570 −899.4 C1 77 −3500 −899.4 C2 78 −3430 −899.4 C3 79 −3360 −899.4 C4 80 −3290 −899.4 SYMBOL PAD x y |
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