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PCF8549U/2/F1 数据表(PDF) 29 Page - NXP Semiconductors |
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PCF8549U/2/F1 数据表(HTML) 29 Page - NXP Semiconductors |
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29 / 36 page  1997 Nov 21 29 Philips Semiconductors Product specification 65 × 102 pixels matrix LCD driver PCF8549 BONDING PADS VALUE UNIT Pad pitch min. 100 µm Pad size, alumin. 80 × 100 µm Passivation. 48 × 78 µm Bumps 60 ( ±6) × 90 (±6) × 17.5 (±5) µm Wafer thickness 380 ( ±25) µm |
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