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TMF8801 数据表(PDF) 69 Page - OSRAM GmbH

部件名 TMF8801
功能描述  Time-of-Flight Sensor
PDF  73 Pages
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制造商  OSRAM [OSRAM GmbH]
网页  http://www.osram.com
标志 OSRAM - OSRAM GmbH

TMF8801 数据表(HTML) 69 Page - OSRAM GmbH

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TMF8801
Soldering & Storage Information
Datasheet
• PUBLIC
DS000648
• v10-00 • 2022-Dec-20
72
│ 68
Parameter
Reference
Device
Time above 230 °C (T2)
t2
Max 50 s
Time above Tpeak
– 10 °C (T3)
t3
Max 10 s
Peak temperature in reflow
Tpeak
260 °C
Temperature gradient in cooling
Max −5 °C/s
12.2
Storage Information
12.2.1
Moisture Sensitivity
Optical characteristics of the device can be adversely affected during the soldering process by the
release and vaporization of moisture that has been previously absorbed into the package.
To ensure the package contains the smallest amount of absorbed moisture possible, each device is
baked prior to being dry packed for shipping. Devices are dry packed in a sealed aluminized envelope
called a moisture-barrier bag with silica gel to protect them from ambient moisture during shipping,
handling, and storage before use.
Shelf Life
The calculated shelf life of the device in an unopened moisture barrier bag is 24 months from the date
code on the bag when stored under the following conditions:
Shelf Life: 24 months
Ambient Temperature: <40 °C
Relative Humidity: <90 %
Rebaking of the devices will be required if the devices exceed the 24 month shelf life or the Humidity
Indicator Card shows that the devices were exposed to conditions beyond the allowable moisture
region.
Floor Life
The module has been assigned a moisture sensitivity level of MSL 3. As a result, the floor life of
devices removed from the moisture barrier bag is 168 hours from the time the bag was opened,
provided that the devices are stored under the following conditions:
Floor Life: 168 hours
Ambient Temperature: <30 °C
Relative Humidity: <60 %
If the floor life or the temperature/humidity conditions have been exceeded, the devices must be
rebaked prior to solder reflow or dry packing.



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