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TMF8801 数据表(PDF) 69 Page - OSRAM GmbH |
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TMF8801 数据表(HTML) 69 Page - OSRAM GmbH |
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69 / 73 page ![]() Document Feedback TMF8801 Soldering & Storage Information Datasheet • PUBLIC DS000648 • v10-00 • 2022-Dec-20 72 │ 68 Parameter Reference Device Time above 230 °C (T2) t2 Max 50 s Time above Tpeak – 10 °C (T3) t3 Max 10 s Peak temperature in reflow Tpeak 260 °C Temperature gradient in cooling Max −5 °C/s 12.2 Storage Information 12.2.1 Moisture Sensitivity Optical characteristics of the device can be adversely affected during the soldering process by the release and vaporization of moisture that has been previously absorbed into the package. To ensure the package contains the smallest amount of absorbed moisture possible, each device is baked prior to being dry packed for shipping. Devices are dry packed in a sealed aluminized envelope called a moisture-barrier bag with silica gel to protect them from ambient moisture during shipping, handling, and storage before use. Shelf Life The calculated shelf life of the device in an unopened moisture barrier bag is 24 months from the date code on the bag when stored under the following conditions: ● Shelf Life: 24 months ● Ambient Temperature: <40 °C ● Relative Humidity: <90 % Rebaking of the devices will be required if the devices exceed the 24 month shelf life or the Humidity Indicator Card shows that the devices were exposed to conditions beyond the allowable moisture region. Floor Life The module has been assigned a moisture sensitivity level of MSL 3. As a result, the floor life of devices removed from the moisture barrier bag is 168 hours from the time the bag was opened, provided that the devices are stored under the following conditions: ● Floor Life: 168 hours ● Ambient Temperature: <30 °C ● Relative Humidity: <60 % If the floor life or the temperature/humidity conditions have been exceeded, the devices must be rebaked prior to solder reflow or dry packing. |
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