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TMF8801 数据表(PDF) 3 Page - OSRAM GmbH |
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TMF8801 数据表(HTML) 3 Page - OSRAM GmbH |
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3 / 73 page ![]() Document Feedback TMF8801 Content Guide Datasheet • PUBLIC DS000648 • v10-00 • 2022-Dec-20 72 │ 2 Content Guide 1 General Description ...................... 3 1.1 Key Benefits & Features............................... 3 1.2 Applications .................................................. 4 1.3 Block Diagram .............................................. 4 2 Ordering Information .................... 5 3 TMF8801 Module Description....... 6 3.1 Pin Diagram.................................................. 6 3.2 Pin Description ............................................. 6 4 Absolute Maximum Ratings ......... 8 5 Electrical Characteristics.............. 9 5.1 Recommended Operating Conditions .......... 9 6 Typical Operating Characteristics ............................ 10 7 Functional Description................ 13 7.1 I²C Protocol................................................. 13 7.2 System Parameters .................................... 13 7.3 I/O ............................................................... 14 7.4 Power Consumption ................................... 15 7.5 Timing......................................................... 16 7.6 Algorithm Performance............................... 17 7.7 VCSEL........................................................ 19 7.8 Typical Optical Characteristics ................... 19 8 Register Description ................... 21 8.1 APPID Register (Address 0x00)................. 21 8.2 APPREV_MAJOR Register (Address 0x01)........................................................... 21 8.3 APPREQID Register (Address 0x02) ......... 21 8.4 ENABLE Register (Address 0xE0) ............. 22 8.5 INT_STATUS Register (Address 0xE1) .....22 8.6 INT_ENAB Register (Address 0xE2)..........23 8.7 ID Register (Address 0xE3)........................23 8.8 REVID Register (Address 0xE4) ................24 8.9 App0 Registers – appid=0xC0....................24 8.10 Bootloader Registers – appid=0x80 ...........55 9 Application Information............... 59 9.1 SPAD Options ............................................59 9.2 Reference SPAD, TDC and Histogram ......60 9.3 Schematic ...................................................61 9.4 PCB Layout.................................................63 9.5 PCB Pad Layout .........................................64 10 Package Drawings & Markings ... 65 11 Tape & Reel Information.............. 66 12 Soldering & Storage Information 67 12.1 Soldering Information .................................67 12.2 Storage Information ....................................68 13 Laser Eye Safety .......................... 70 14 Revision Information ................... 71 15 Legal Information......................... 72 |
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