TSL2569CS datasheet(44/56 Pages) OSRAM

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ams Datasheet

Page 43

[v1-00] 2016-Apr-12

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TSL2568, TSL2569 − Packaging Mechanical Data

Figure 41:

Package CS - Six-Lead Chipscale Packaging Configuration

Note(s):

1. All linear dimensions are in micrometers. Dimension tolerance is ±25μm unless otherwise noted.

2. Solder bumps are formed of Sn (96.5%), Ag (3%), and Cu (0.5%).

3. The top of the photodiode active area is 410μm below the top surface of the package.

4. The layer above the photodiode is glass and epoxy with an index of refraction of 1.53.

5. This drawing is subject to change without notice.

Packaging Mechanical Data

171

1398

465

203

1250

y 100

400

+ 50

700

+ 55

TYP 30

500

375

+ 30

500

375

+ 30

1750

TOP VIEW

SIDE VIEW

BOTTOM VIEW

END VIEW

y j 210 + 30

PIN OUT

BOTTOM VIEW

Green

RoHS

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