MPC826XACVR datasheet(48/52 Pages) FREESCALE

48 / 52 page

MPC8260A PowerQUICC™ II Integrated Communications Processor Hardware Specifications, Rev. 1.1

Freescale Semiconductor

Ordering Information

Figure 16 provides an example of the Freescale part numbering nomenclature for the MPC826xA. In

addition to the processor frequency, the part numbering scheme also consists of a part modifier that

indicates any enhancement(s) in the part from the original production design. Each part number also

contains a revision code that refers to the die mask revision number and is specified in the part numbering

scheme for identification purposes only. For more information, contact your local Freescale sales office.

Figure 16. Freescale Part Number Key

Document Revision History

Table 23 lists significant changes in each revision of this document.

Table 23. Document Revision History

Revision

Date

Substantive Changes

—

Initial version

0.1

8/2001

• Table 8: Change to sp20/sp21.

0.2

11/2001

• Revision of Table 5, “Power Dissipation”

• Modifications to Figure 9, Table 2,Table 10, Table 11, and Table 18

• Modification to pinout diagram, Figure 13

• Additional revisions to text and figures throughout

Product Code

Device Number

Process Technology

Package

ZU = 480 TBGA

Processor Frequency

Die Revision Level

MPC 826X A

(None = 0.29 micron

C ZU XXX

(CPU/CPM/Bus)

A = 0.25 micron)

Temperature Range

(Blank = 0 to 105 °C

C = -40 to 105 °C

VR = 516 PBGA

MPC826XACVR 数据表(PDF) 48 Page - Freescale Semiconductor, Inc

MPC826XACVR 数据表(HTML) 48 Page - Freescale Semiconductor, Inc

Html Pages

1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 33 34 35 36 37 38 39 40 41 42 43 44 45 46 47 48 49 50 51 52

数据表下载