MPC826XACVR datasheet(12/52 Pages) FREESCALE

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MPC8260A PowerQUICC™ II Integrated Communications Processor Hardware Specifications, Rev. 1.1

Freescale Semiconductor

Electrical and Thermal Characteristics

2.2

Thermal Characteristics

Table 4 describes thermal characteristics.

2.3

Power Considerations

The average chip-junction temperature, TJ, in °C can be obtained from the following:

TJ = TA + (PD x θJA)

(1)

where

TA = ambient temperature °C

JA = package thermal resistance, junction to ambient, °C/W

PD = PINT + PI/O

PINT = IDD x VDD Watts (chip internal power)

PI/O = power dissipation on input and output pins (determined by user)

For most applications PI/O < 0.3 x PINT. If PI/O is neglected, an approximate relationship between PD and

TJ is the following:

Notes:

1. The default configuration of the CPM pins (PA[0–31], PB[4–31], PC[0–31], PD[4–31]) is input. To prevent

excessive DC current, it is recommended to either pull unused pins to GND or VDDH, or to configure them as

outputs.

2. The leakage current is measured for nominal VDD, VCCSYN, and VDD.

3. MPC8265 and MPC8266 only.

Table 4. Thermal Characteristics for 480 TBGA Package

Characteristics

Symbol

Value

Unit

Air Flow

Junction to ambient

θJA

13(1)

Notes:

1. Assumes a single layer board with no thermal vias

°C/W

NC(2)

2. Natural convection

101

1 m/s

11(3)

3. Assumes a four layer board

1 m/s

Junction to board(4)

4. Thermal resistance between the die and the printed circuit board per JEDEC JESD51-8. Board temperature

is measured on the top surface of the board near the package.

θJB

°C/W

—

Junction to case(5)

5. Thermal resistance between the die and the case top surface as measured by the cold plate method (MIL

SPEC-883 Method 1012.1).

θJC

1.1

°C/W

—

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