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DS20005164H-page 21

SST25WF080B

6.0

ELECTRICAL SPECIFICATIONS

Absolute Maximum Ratings (†)

Temperature under bias ..........................................................................................................................-55°C to +125°C

Storage temperature ...............................................................................................................................-55°C to +150°C

DC voltage on any pin to ground potential...........................................................................................-0.5V to VDD+0.5V

Transient voltage (<20 ns) on any pin to ground potential ...................................................................-2.0V to VDD+2.0V

Package power dissipation capability (TA = 25°C)....................................................................................................1.0W

Surface mount solder reflow temperature.......................................................................................260°C for 10 seconds

Output short circuit current(1) ..................................................................................................................................50 mA

6.1

Power-Up Specifications

All functionalities and DC specifications are specified

for a VDD ramp rate of greater than 1V per 100 ms (0V

to 1.8V in less than 180 ms). See Table 6-3 and

Figure 6-1 for more information.

† NOTICE: Stresses above those listed under “Absolute Maximum Ratings” may cause permanent damage to the

device. This is a stress rating only and functional operation of the device at those or any other conditions above those

indicated in the operational listings of this specification is not implied. Exposure to maximum rating conditions for

extended periods may affect device reliability.

Note 1: Output shorted for no more than one second. No more than one output shorted at a time.

TABLE 6-1:

OPERATING RANGE

Range

Ambient Temp

VDD

Industrial

-40°C to +85°C

1.65V - 1.95V

Extended

-40°C to +125°C

1.65V - 1.95V

TABLE 6-2:

AC CONDITIONS OF TEST

Input Rise/Fall Time

Output Load

5ns

CL =30pF

TABLE 6-3:

RECOMMENDED SYSTEM POWER-UP TIMINGS

Symbol

Parameter

Minimum

Units

TPU-READ

VDD Min to Read Operation

500

µs

TPU-WRITE(1)

VDD Min to Write Operation

500

µs

Note 1:

This parameter is measured only for initial qualification and after a design or process change that could affect

this parameter.