SST25WF080B datasheet(39/44 Pages) MICROCHIP

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 2013-2022 Microchip Technology Inc. and its subsidiaries

DS20005164H-page 39

SST25WF080B

8.0

REVISION HISTORY

Revision H (November 2022)

Updated Non-Automotive Product Identification Sys-

tem.

Revision G (September 2022)

Updated Automotive Product Identification System;

Updated SOIC package drawings.

Revision F (July 2022)

Replaced terminology “Master” and “Slave” with “Host”

and “Client” respectively; Updated SOIC package

drawings; Added Automotive Product Identification

System.

Revision E (May 2018)

Added content relating to passing die qualification for

Extended temperature. Added AECQ-100 Qualified in

“Features” section on page 1.

Revision D (November 2017)

Updated package drawings.

Revision C (January 2014)

Removed “Preliminary” status from the footer.

Revision B (August 2013)

Updated “Product Identification System” on page 41.

Changed all occurrences of TCE to TSCE. Updated

Figure 6-6 on page 27 and Table 6-8 on page 25.

Revision A (April 2013)

Initial release of the document.

SST25WF080B 数据表(PDF) 39 Page - Microchip Technology