SCREEN MASTER® 5-MM OVAL LEDs C566C-RFF/RFE/AFF/AFE

© 2021-2024 Cree LED. The information in this document is subject to change without notice. Cree®, the Cree logo and the Cree LED logo are registered

trademarks of Cree LED.

CLD-CT1241

REV 5

8

SOLDERING GUIDELINES

The LED soldering specification is shown below(suitable for both leaded solder & lead-free solder):

Manual Soldering

Solder Dipping

Soldering iron

35 W max

Preheat

110 ºC max

Temperature

300 ºC max

Preheat time

60 seconds max

Solder-bath temperature

260 ºC Max

Soldering time

3 seconds max

Dipping time

5 seconds max

Position

Not less than 3 mm from the base of the package.

Position

Not less than 3 mm from the base of the package.

• Manual soldering onto the PCB is not recommended because soldering time is uncontrollable.

• The recommended wave soldering is as below:

10

20

30

40

50

60

70

80

90

100

110

120

0

30

150

100

300

250

200

50

Times (sec)

laminar wave

Fluxing

Preheat

• Do not apply any stress to the LED package, particularly when heated.

• Only bottom preheat is suggested & should not preheat on top in order to reduce thermal stress experienced by the LEDs.

• The LEDs must not be re used once they have been extracted from PCB.

• After soldering the LEDs, the package should be protected from mechanical shock or vibration until the LEDs have reached 40 ºC or

below.

• Precautions must be taken as mechanical stress on the LEDs may be caused by PCB warpage or from the clinching and cutting of

the LED leads.

• When it is necessary to clam the LEDs during soldering, it is important to ensure no mechanical stress is exerted on the LEDs.

• Cut the LED lead at normal room temperature. Lead cutting at high temperature may cause failure of the LEDs.

• Please refer to the HB LED Lamp Soldering & Handling document for information about how to use this LED product safely.