ADA4098-1BUJZ-R5 datasheet(8/33 Pages) AD

8 / 33 page

Data Sheet

ADA4098-1/ADA4098-2

ABSOLUTE MAXIMUM RATINGS

analog.com

Rev. B | 8 of 33

Table 3.

Parameter

Rating

Supply Voltage1

Transient

60 V

Continuous

50 V

Power Dissipation (PD)

See Figure 3

Differential Input Voltage

±80 V

±IN Pin Voltage

Continuous

−10 V to +80 V

Survival

−20 V to +80 V

±IN Pin Current

15 mA

SHDN and SHDNx Pin Voltage 2

−0.3 V to +60 V

Storage Temperature Range

−65°C to +150°C

Operating Temperature Range

−55°C to +150°C

Lead Temperature (Soldering, 10 sec)

300°C

175°C

1 Maximum supply voltage is limited by the TDDB of the on-chip capacitor ox-

ides. The amplifiers tolerate temporary transient overshoot up to the specified

transient maximum rating. The continuous operating supply voltage must be

limited to no more than 50 V.

2 SHDN is Pin 5 on the ADA4098-1. SHDNx refers to SHDN1 and SHDN2 (Pin 5

and Pin 6, respectively) on the ADA4098-2 (10-lead LFCSP).

Stresses at or above those listed under Absolute Maximum Ratings

may cause permanent damage to the device. This is a stress rating

only; functional operation of the product at these or any other

conditions above those indicated in the operational section of this

specification is not implied. Operation beyond the maximum operat-

ing conditions for extended periods may affect product reliability.

Junction temperatures (TJ) exceeding 125°C promotes accelerated

aging. The ADA4098-1 and ADA4098-2 demonstrate ±25 V supply

operation beyond 1000 hours at TA = 150°C.

MAXIMUM POWER DISSIPATION

The maximum safe PD on the devices is limited by the associated

rise in either case temperature (TC) or TJ on the die. At approxi-

mately TC = 150°C, which is the glass transition temperature, the

properties of the plastic changes. Exceeding this temperature limit,

even temporarily, may change the stresses that the package exerts

on the die, which permanently shifts the parametric performance

of the ADA4098-1 and ADA4098-2. Exceeding TJ = 175°C for an

extended period may result in changes in the silicon devices and

may potentially cause failure of the devices.

The PD on the package is the sum of the quiescent power dissipa-

tion and the power dissipated in the package due to the output load

drive. The quiescent power is expressed as VSY × ISY, where ISY is

the quiescent current.

The PD due to the load drive depends on the application. The PD

due to load drive is calculated by multiplying the load current by

the associated voltage drop across the devices. RMS voltages and

currents must be used in these calculations.

Airflow increases heat dissipation, effectively reducing θJA. Addi-

tional metal that is directly in contact with the package leads from

metal traces through vias, ground, and power planes reduces θJA.

Figure 3 shows the maximum PD vs. TA for the single and dual

6-lead TSOT packages on a JEDEC standard, 4‑layer board, with

−VS connected to a pad that is thermally connected to a printed

circuit board (PCB) plane. θJA values are approximations.

Figure 3. Maximum Power Dissipation vs. Ambient Temperature

THERMAL RESISTANCE

Thermal performance is directly linked to PCB design and operating

environment. Careful attention to PCB thermal design is required.

θJA is the junction to ambient thermal resistance.

Table 4. Thermal Resistance

Package Type

θJA

Unit

UJ-6

192

°C/W

R-8

120

°C/W

RM-8

163

°C/W

05-08-1699

°C/W

ELECTROSTATIC DISCHARGE (ESD) RATINGS

The following ESD information is provided for handling of ESD-sen-

sitive devices in an ESD protected area only.

Human body model (HBM) per ANSI/ESDA/JEDEC JS-001.

Field induced charged device model (FICDM) per ANSI/ESDA/JE-

DEC JS-002.

ESD Ratings for ADA4098-1/ADA4098-2

Table 5. ADA4098-1 6-Lead TSOT, ADA4098-2 8-Lead SOIC_N, ADA4098-2

8-Lead MSOP, ADA4098-2 10-Lead LFCSP

ESD Model

Withstand Threshold (kV)

Class

HBM

±3

FICDM

±1.25

ADA4098-1BUJZ-R5 数据表(PDF) 8 Page - Analog Devices

ADA4098-1BUJZ-R5 数据表(HTML) 8 Page - Analog Devices

Html Pages

1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 33

数据表下载

链接网址

ADA4098-1BUJZ-R5 数据表(PDF) 8 Page - Analog Devices

ADA4098-1BUJZ-R5 数据表(HTML) 8 Page - Analog Devices

Html Pages

1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 33

数据表 下载

链接网址

数据表下载