TECHNOLOGY SOLUTIONS

Semiconductor industry demands for higher levels of integration and

lower costs coupled with a growing awareness of complete system

configuration have continued to drive the popularity of System in

Package (SiP) solutions. Amkor’s SiP state-of-art design rules is an

ideal solution in markets that demand miniaturization with increased

functionality. By assembling, testing and shipping millions of SiP

devices per day, Amkor Technology has a proven track record as the

industry leader in SiP design, assembly and test.

System in Package

What Is a System in Package?

Amkor Technology defines advanced SiPs as multi-component, multi-

function products in an IC package. They require high-precision assembly

technologies, which leverage Amkor's strengths.

Top and bottom side assembly, molding, conformal and

compartmental shielding

MEMS

WLCSP

Flip chip

Compartmental shielding

A

B

C

D

B

A

C

D

Passive components

Pre-packaged

Wirebond

Stacked die

E

F

G

H

E

F

G

H

f

Size reduction & ultra-thin

package

f

Thin substrate with core and

coreless using finer line and

spacing

f

Conformal and compartmental

shielding

f

Low filler size for mold

underfill

f

Fine pitch flip chip and copper

pillar

f

Double side assembly

f

Test development and

production test

f

Turnkey solution

f

Manufacturing excellence

APPLICATIONS

f

RF and wireless devices

▷ Power amplifiers, front-end

module, antenna switch, cellular

handset, cellular infrastructure,

5G NR, Sub-6 GHz, mmWave and

Antenna in Package (AiP/AoP)

f

IoT, wearables/hearables and Machine

to Machine (M2M)

▷ BLTe, Wi-Fi, UWB, LTE-M & NB-

IoT; controller and mixed-mode

devices

f

Automotive applications

▷ Infotainment and sensory

modules

f

Power modules

▷ DC/DC converter, PMIC, battery

management and others

f

Computing and networking

▷ 5G networking, infrastructure

and data center