Unshielded SiP

Near Field Conformal Shielding Performance Measurements From 100 MHz

to 6 GHz

AiP/AoP (5G NR) SiP Solutions

Millimeter wave radio design with beam forming and array antenna will be used in varieties of advanced SiP products

for 5G cellular system. Millimeter electromagnetic wave design is imposing a new challenge for the system designers,

components and SiP packaging engineers.

Key Amkor Packaging Technologies for AiP/AoP

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Greater than 40 GHz achieved

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Compartmental shielding using vertical and gage wires

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Partial (selective) conformal shielding

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Partial molding

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Substrate layer counts: Up to 14 layers

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Low loss and low dielectric constant substrate

System in Package Technology

x (mm)

Unshielded DUT – Ex magnitude maximum radiation

SiP With Sputter Conformal Shielding

x (mm)

3 µm Cu – Ex maximum radiation