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System in Package Technology

Manufacturing Excellence

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Amkor’s Center of Excellence for substrate-based

SiP technology is located in our largest volume

manufacturing facility in K4 Gwangju, South Korea

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The large-scale manufacturing capabilities in K4

factory can achieve significant volume production

support with very high yields with short cycle times

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Latest advanced technology that supports high

speed, high-accuracy chip and component

placement

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Amkor’s SiP design rules are the most advanced in

the industry and are available to customers through

a web portal access system

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Amkor production lines have full automation, in-line

inspection, RFID control and other process control

methods to ensure the highest yields and quality

while minimizing any potential loss of bill of material

(BOM) components

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Ultra-high-speed SMT placement machines with

leading-edge component placement accuracy for

best quality and lowest cost

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Flexible placement machines are ideally suited for

odd-form component placement

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Capability to place any common component format

available in tape and reel format down to and

including the smallest 008004 size

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Capability of mounting bumped die directly from

wafer tape

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Support for solder paste stencil printing, flux stencil

printing or flux dipping processes

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Automated 100% in-line optical inspection of solder

paste to reduce BOM component loss

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Support for all common RoHS/Green compliant

solder alloys

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Amkor supports Engineering Build Requests (EBRs)

on dedicated rapid-turn “New Product Introduction”

lines

▷ The lines are exactly the same as the high-

volume manufacturing lines

▷ Seamless NPI transfer to production

▷ Large number of rapid-turn EBRs to facilitate RF

tuning of the parts

▷ Close collaborative process with customers

Supply Chain Management

Supply chain considerations play a major factor in the

success of SiP product realization and impact both

design and manufacturing. To optimize the complete

SiP process, Amkor has expanded its traditional supply

chain expertise into passive components, and other

parts not traditionally found in the package assembly

environment. As a result, Amkor can manage the

supply chain to ensure successful SiP development and

production.

SiP Technologies From Amkor

System in Package is the modular design approach

offering unprecedented flexibility in product

development. The end user benefits from a faster

time-to-market include reduced cycle times for system

design, lower development risk compared to SoC IC

development, flexibility, tuned functional performance,

and, ultimately, a lower overall cost of ownership.

Amkor has developed an extensive toolset to maximize

circuit density and address the sophisticated packaging

formats required to productize 5G applications – such

as double-sided assembly, embedded die in substrate,

thin film RDL & dielectrics, and various types of RF

shielding. This toolset, combined with extensive SiP

capacity and AiP/AoP technology, uniquely positions

Amkor to serve customers who want to outsource

the challenges and high investment associated with

combining multiple ICs with advanced package

assembly and test technologies for 5G networks.

Amkor’s SiP technology is an ideal solution in markets

that demand smaller size with increased functionality.

By assembling, testing and shipping more than one

million SiP devices per day, Amkor Technology has a

proven track record as the industry leader in SiP design,

assembly and test. Contact Amkor today and let us add

you to our growing list of customers enjoying success

with System in Package technology.