f

Embedded passive &

active components

f

Passive components

(01005, 008004)

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Double sided

assembly DSBGA

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Double sided mold

DSMBGA

Markets for System in Package

System in Package technology allows multiple advanced packaging technologies to be combined to create solutions

customized to each end application. Laminate-based SiP technology is a front runner solution and the most popular

SiP solution for cellular, IoT, power, automotive, networking and computing system integrations.

f

Thin substrate, core and coreless substrate,

recessed and cavity substrate

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Partial molding and partial conformal shielding

▷ Connector, antenna and partial mold & shield

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Sputtering conformal shielding and compartmental

conformal shielding

▷ Amkor developed an exceptional sputtering

shielding technology to solve electromagnetic

radiation effects among electronic components

within SiP components and surrounding

environment with excellent electrical and

magnetic shielding performance

▷ Compartment shielding with Cu wire

⨠ Wire cage

⨠ Wire fence

⨠ Vertical wire

Wire Cage

Wire Fence

Vertical Wire

System in Package Technology

SiP Platforms and Solutions

Amkor's emphasis is on functional integration and size

reduction by using different package form factors and

interconnect technologies, including:

Wire fence

Wire cage

Vertical wire

Mobility

IoT

Automotive

Power Management

Mixed-Mode Technology

Computer & Networking

EMC

Embedded die in substrate

EDS substrate

Cap.