Advanced SiP Testing

As part of its complete SiP design solution, Amkor has developed expertise in RF and digital testing, including test

system software/hardware development and manufacturing test.

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Comprehensive test services that complement wafer level and package assembly

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Amkor is the #1 RF test services supplier for Sub-6 GHz

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Ongoing joint efforts with test equipment suppliers and customers to enable 5G product production testing

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Amkor has a vast array of test capabilities and rich experience in device testing

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Offers an extensive equipment fleet and continues to invest in new capabilities required to test the latest devices

Thermal Mechanical and Electromagnetic Characterization and Design

Considerations

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Warpage optimization

▷ Module level and strip level warpage

▷ Warpage at room temperature and reflow temperature

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Stress analysis

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Die, bump, substrate stress analysis

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Correlate to FA to help root cause analysis and correction options

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BLR characterization

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Board level temperature cycle life performance prediction

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Die attach delamination stress analysis

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Material properties measurements including CTE, modulus, Tg, Theta JA, Theta JB and Theta JC

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Accelerated failure testing

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Electromigration as function of temperature, time current and interconnect

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Bend and drop testing

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Die strength and stress

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Surface mount assembly support

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Failure and reliability analysis

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Thermal simulation and air flow effects

System in Package Technology