Maximum rating

M41T256Y

22/30

4

Maximum rating

Stressing the device above the rating listed in the “Absolute Maximum Ratings” table may

cause permanent damage to the device. These are stress ratings only and operation of the

device at these or any other conditions above those indicated in the Operating sections of

this specification is not implied. Exposure to Absolute Maximum Rating conditions for

extended periods may affect device reliability. Refer also to the STMicroelectronics SURE

Program and other relevant quality documents.

Table 5.

Absolute maximum ratings

Caution:

Negative undershoots below –0.3V are not allowed on any pin while in the Battery Back-up

mode.

Caution:

Do NOT wave solder SOIC to avoid damaging SNAPHAT sockets.

Symbol

Parameter

Value

Unit

–40 to 85

°C

SOIC

–55 to 125

°C

(1)

1.

For SO package, standard (SnPb) lead finish: Reflow at peak temperature of 225°C (total thermal budget

not to exceed 180°C for between 90 to 150 seconds).

For SO package, Lead-free (Pb-free) lead finish: Reflow at peak temperature of 260°C (total thermal

budget not to exceed 245°C for greater than 30 seconds).

Lead solder temperature for 10 seconds

260

°C

Input or output voltages

V

Supply voltage

–0.3 to 7.0

V

Output current

20

mA

Power dissipation

1

W