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M41T256YMT7F 数据表(PDF) 26 Page - STMicroelectronics |
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M41T256YMT7F 数据表(HTML) 26 Page - STMicroelectronics |
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26 / 30 page ![]() Package mechanical data M41T256Y 26/30 6 Package mechanical data In order to meet environmental requirements, ST offers these devices in ECOPACK® packages. These packages have a Lead-free second level interconnect. The category of second Level Interconnect is marked on the package and on the inner box label, in compliance with JEDEC Standard JESD97. The maximum ratings related to soldering conditions are also marked on the inner box label. ECOPACK is an ST trademark. ECOPACK specifications are available at: www.st.com. Figure 15. SOH44 – 44-lead plastic small outline, SNAPHAT, package outline Note: Drawing is not to scale. Table 11. SOH44 – 44-lead plastic small outline, SNAPHAT, package mech. data SOH-A E N D C L A1 α 1 H A CP Be A2 eB Symb mm inches Typ Min Max Typ Min Max A 3.05 0.120 A1 0.05 0.36 0.002 0.014 A2 2.34 2.69 0.092 0.106 B 0.36 0.46 0.014 0.018 C 0.15 0.32 0.006 0.012 D 17.71 18.49 0.697 0.728 E 8.23 8.89 0.324 0.350 e0.81– – 0.032 – – eB 3.20 3.61 0.126 0.142 H 11.51 12.70 0.453 0.500 L 0.41 1.27 0.016 0.050 a0° 8° 0° 8° N44 44 CP 0.10 0.004 |
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