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PCF8563T/F4 数据表(PDF) 38 Page - NXP Semiconductors |
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PCF8563T/F4 数据表(HTML) 38 Page - NXP Semiconductors |
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38 / 45 page ![]() PCF8563 All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2015. All rights reserved. Product data sheet Rev. 11 — 26 October 2015 38 of 45 NXP Semiconductors PCF8563 Real-time clock/calendar For further information on temperature profiles, refer to Application Note AN10365 “Surface mount reflow soldering description”. 18. Abbreviations MSL: Moisture Sensitivity Level Fig 32. Temperature profiles for large and small components 001aac844 temperature time minimum peak temperature = minimum soldering temperature maximum peak temperature = MSL limit, damage level peak temperature Table 33. Abbreviations Acronym Description BCD Binary Coded Decimal CDM Charged-Device Model CMOS Complementary Metal Oxide Semiconductor ESD ElectroStatic Discharge HBM Human Body Model I2C Inter-Integrated Circuit IC Integrated Circuit LSB Least Significant Bit MSB Most Significant Bit MSL Moisture Sensitivity Level PCB Printed-Circuit Board POR Power-On Reset RTC Real-Time Clock SCL Serial CLock line SDA Serial DAta line SMD Surface Mount Device |
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