MCU

TMP103A

TMP103B

TMP103C

SCL

SCL

SCL

SDA

SDA

SDA

Out

IO

V+

V+

19

TMP103

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SBOS545D – FEBRUARY 2011 – REVISED DECEMBER 2018

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Copyright © 2011–2018, Texas Instruments Incorporated

8 Application and Implementation

NOTE

Information in the following applications sections is not part of the TI component

specification, and TI does not warrant its accuracy or completeness. TI’s customers are

responsible for determining suitability of components for their purposes. Customers should

validate and test their design implementation to confirm system functionality.

8.1 Application Information

The TMP103 is a digital output temperature sensor in a DSBGA package that is optimal for thermal management

and thermal profiling. The TMP103 includes a two-wire interface that is compatible with both I2C and SMBus

interfaces. In addition, the TMP103 has the capability of executing multiple device access (MDA) commands that

allows multiple TMP103 devices to respond to a single global bus command. MDA commands reduce

communication time and power in a bus that contains multiple TMP103 devices. The TMP103 is specified over a

temperature range of –40ºC to 125ºC.

The TMP103 serial interface is designed to support up to eight TMP103 devices on a single bus. The TMP103 is

offered with eight internal interface addresses. Each unique address option can be used as a location or

temperature zone designator. The TMP103 responds to standard I2C and SMBus slave protocols that allow the

internal registers to be written to or read from on an individual basis. The TMP103 also responds to MDA

commands that allow all the devices on the bus to be written to or read from, without having to send the

individual address and commands to each device.

8.2 Typical Application

Figure 16. Typical Application Diagram

8.2.1 Design Requirements

The TMP103 device requires pullup resistors on the SCL and SDA pins. The pullup resistor values must be

selected such that the maximum current sinking capability of I/O pins is not violated. TI recommends a 0.01-μF

bypass capacitor on the supply.

8.2.2 Detailed Design Procedure

The TMP103 devices must be placed in close proximity to the heat source that must be monitored, with a proper

layout for good thermal coupling. This placement ensures that temperature changes are captured within the

shortest possible time interval. To maintain accuracy in applications that require air or surface temperature

measurement, take care to isolate the package and leads from ambient air temperature. The TMP103 device is a

very low-power device and generates very low noise on the supply bus. Applying an RC filter to the V+ pin of the

TMP103 device can further reduce any noise that the TMP103 device might propagate to other components.