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An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications,

intellectual property matters and other important disclaimers. PRODUCTION DATA.

TMP103

SBOS545D – FEBRUARY 2011 – REVISED DECEMBER 2018

TMP103 Low-Power, Digital Temperature Sensor With Two-Wire Interface in WCSP

1

1 Features

1

•

Multiple Device Access (MDA):

–

Global Read/Write Operations

•

I2C™ and SMBus™-Compatible Interface

•

Resolution: 8 Bits

•

Accuracy: ±1°C Typical (–10°C to 100°C)

•

Low Quiescent Current:

–

3-μA Active IQ at 0.25 Hz

–

1-μA Shutdown

•

Supply Range: 1.4 V to 3.6 V

•

Digital Output

•

4-Ball WCSP (DSBGA) Package

2 Applications

•

Handsets

•

Notebooks

•

SSDs

•

Servers

•

Telecom

•

Set Top Boxes

•

Low Power Environmental

•

Sensors

3 Description

The TMP103 is a digital output temperature sensor in

a four-ball wafer chip-scale package (WCSP). The

TMP103 is capable of reading temperatures to a

resolution of 1°C.

The TMP103 features a two-wire interface that is

compatible with both I2C and SMBus interfaces. In

addition,

the

interface

supports

multiple

device

access (MDA) commands that allow the master to

communicate with multiple devices on the bus

simultaneously,

eliminating

the

need

to

send

individual commands to each TMP103 on the bus.

Up to eight TMP103s can be tied together in parallel

and easily read by the host. The TMP103 is

especially suitable for space-constrained, power-

sensitive

applications

with

multiple

temperature

measurement zones that must be monitored.

The TMP103 is specified for operation over a

temperature range of –40°C to 125°C.

Device Information(1)

PART NUMBER

PACKAGE

BODY SIZE (NOM)

TMP103

DSBGA (4)

0.76 mm × 0.76 mm

(1) For all available packages, see the orderable addendum at

the end of the data sheet.

Typical Application Diagram