SDA

B2

A2

B1

A1

SCL

GND

V+

3

TMP103

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SBOS545D – FEBRUARY 2011 – REVISED DECEMBER 2018

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5 Pin Configuration and Functions

YFF Package

4-Ball DSBGA

Top View

Pin Functions

PIN

I/O

DESCRIPTION

NO.

NAME

A1

V+

I

Supply voltage

A2

GND

I

Ground

B1

SDA

I/O

Input/output data pin

B2

SCL

I

Input clock pin

(1)

Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings

only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended

Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

6 Specifications

6.1 Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted)

(1)

MIN

MAX

UNIT

V+

Supply voltage

4

V

Voltage at SCL and SDA

–0.3

((V+) + 0.3)

and

≤ 4

V

Operating temperature

–55

150

°C

TJ

Junction temperature

150

°C

Tstg

Storage temperature

–60

150

°C

(1)

JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.

(2)

JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.

6.2 ESD Ratings

VALUE

UNIT

V(ESD)

Electrostatic discharge

Human body model (HBM), per ANSI/ESDA/JEDEC JS-001, all pins(1)

±2000

V

Charged device model (CDM), per JEDEC specification JESD22-C101, all

pins(2)

±1000

Machine model (MM)

±200

6.3 Recommended Operating Conditions

over operating free-air temperature range (unless otherwise noted)

MIN

MAX

UNIT

V+

Supply voltage

1.4

3.6

V

TA

Operating free-air temperature

–40

125

°C