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EXAMPLE BOARD LAYOUT

0.05 MAX

ALL AROUND

(11.4)

(11.4)

60X (0.5)

64X (1.5)

64X (0.3)

(

8) NOTE 7

(

4.44)

(

) TYP

VIA

0.2

(0.5)

TYP

(1)

TYP

(0.5) TYP

(1) TYP

PowerPAD

- 1.2 mm max height

PAP0064M

PLASTIC QUAD FLATPACK

4221602/A 07/2014

TM

NOTES: (continued)

5. Publication IPC-7351 may have alternate designs.

6. Solder mask tolerances between and around signal pads can vary based on board fabrication site.

7. This package is designed to be soldered to a thermal pad on the board. For more information, see Texas Instruments literature

numbers SLMA002 (www.ti.com/lit/slm002) and SLMA004 (www.ti.com/lit/slma004).

8. Size of metal pad may vary due to creepage requirement.

LAND PATTERN EXAMPLE

SCALE:6X

SYMM

SYMM

64

49

17

32

33

48

1

16

SOLDER MASK

DEFINED PAD

SOLDER MASK

OPENING

SEE DETAIL

METAL COVERED

BY SOLDER MASK

METAL

SOLDER MASK

OPENING

NON SOLDER MASK

DEFINED

41

TUSB4041I

www.ti.com

SLLSEK3E – JULY 2015 – REVISED SEPTEMBER 2017

Product Folder Links: TUSB4041I

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