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HIP2104FRAANZ 数据表(PDF) 28 Page - Renesas Technology Corp |
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HIP2104FRAANZ 数据表(HTML) 28 Page - Renesas Technology Corp |
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28 / 31 page ![]() HIP2103, HIP2104 10. Package Outline Drawings FN8276 Rev.2.0 Page 28 of 30 Feb 25, 2021 10. Package Outline Drawings L8.3x3A 8 Lead Thin Dual Flat No-Lead Plastic Package (TDFN) Rev 5, 5/15 located within the zone indicated. The pin #1 identifier may be Unless otherwise specified, tolerance: Decimal ± 0.05 The configuration of the pin #1 identifier is optional, but must be between 0.15mm and 0.20mm from the terminal tip. Dimension applies to the metallized terminal and is measured Dimensions in ( ) for Reference Only. Dimensioning and tolerancing conform to ASME Y14.5m-1994. 6. either a mold or mark feature. 3. 5. 4. 2. Dimensions are in millimeters. 1. NOTES: BOTTOM VIEW DETAIL "X" SIDE VIEW TYPICAL RECOMMENDED LAND PATTERN TOP VIEW C 0 . 2 REF 0 . 05 MAX. 0 . 02 NOM. 5 3.00 A B (4X) 0.15 6 PIN 1 INDEX AREA PIN #1 6X 0.65 1.50 ±0.10 8 1 8X 0.30 ± 0.10 6 0.75 ±0.05 SEE DETAIL "X" 0.08 0.10 C C C ( 2.90 ) (1.50) ( 8 X 0.30) ( 8X 0.50) ( 2.30) ( 1.95) 2.30 ±0.10 0.10 8X 0.30 ±0.05 A MC B 4 2X 1.950 (6x 0.65) INDEX AREA PIN 1 Compliant to JEDEC MO-229 WEEC-2 except for the foot length. 7. Tiebar shown (if present) is a non-functional feature and may be located on any of the 4 sides (or ends). For the most recent package outline drawing, see L8.3x3A. |
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