LP3921

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SNVS580A – AUGUST 2008 – REVISED MAY 2013

Absolute Maximum Ratings

(1) (2)

CHG-IN

−0.3 to +6.5V

VBATT =VIN1/2, BATT, VDD, HF_PWR

−0.3 to +6.0V

All other Inputs

−0.3 to VBATT +0.3V, max 6.0V

Junction Temperature (TJ-MAX)

150°C

Storage Temperature

−40°C to +150°C

Max Continuous Power Dissipation

(PD-MAX)

(3)

Internally Limited

ESD (4)

BATT, VIN1, VIN2, VDD, HF_PWR, CHG_IN, PWR_ON

8 kV HBM

All other pins

2 kV HBM

(1)

Absolute Maximum Ratings are limits beyond which damage to the device may occur. Operating Ratings are conditions under which

operation of the device is verified. Operating Ratings do not imply verified performance limits. For verified performance limits and

associated test conditions, see the Electrical Characteristics tables.

(2)

If Military/Aerospace specified devices are required, please contact the TI Sales Office/Distributors for availability and specifications.

(3)

Internal Thermal Shutdown circuitry protects the device from permanent damage.

(4)

The human-body model is 100 pF discharged through 1.5 k

Ω. The machine model is a 200 pF capacitor discharged directly into each

pin, MIL-STD-883 3015.7.

Operating Ratings

(1) (2)

CHG_IN (3)

4.5 to 6.0V

VBATT =VIN1/2, BATT, VDD

3.0 to 5.5V

HF_PWR, PWR_ON

0V to 5.5V

ACOK_N, SDA, SCL, RX_EN,

TX_EN, TCXO_EN, PS_HOLD,

RESET_N

0V to (VLDO2 + 0.3V)

All other pins

0V to (VBATT + 0.3V)

Junction Temperature (TJ)

−40°C to +125°C

Ambient Temperature (TA)

(4)

-40 to 85°C

(1)

Absolute Maximum Ratings are limits beyond which damage to the device may occur. Operating Ratings are conditions under which

operation of the device is verified. Operating Ratings do not imply verified performance limits. For verified performance limits and

associated test conditions, see the Electrical Characteristics tables.

(2)

All voltages are with respect to the potential at the GND pin.

(3)

Full-charge current is specified for CHG_IN = 4.5 to 6.0V. At higher input voltages, increased power dissipation may cause the thermal

regulation to limit the current to a safe level, resulting in longer charging time.

(4)

Care must be exercised where high power dissipation is likely. The maximum ambient temperature may have to be derated. Like the

Absolute Maximum power dissipation, the maximum power dissipation for operation depends on the ambient temperature. In

applications where high power dissipation and/or poor thermal dissipation exists, the maximum ambient temperature may have to be

derated. Maximum ambient temperature (TA_MAX) is dependent on the maximum power dissipation of the device in the application

(PD_MAX), and the junction to ambient thermal resistance of the device/package in the application (θJA), as given by the following

equation:TA_MAX = TJ_MAX-OP – (θJA X PDMAX ).

Thermal Properties

(1)

Junction to Ambient

Thermal Resistance

θJA

4L Jedec Board

30° C/W

(1)

Junction-to-ambient thermal resistance (

θJA) is taken from thermal modelling result, performed under the conditions and guidelines set

forth in the JEDEC standard JESD51-7. The value of (

θJA) of this product could fall within a wide range, depending on PWB material,

layout, and environmental conditions. In applications where high maximum power dissipation exists (high VIN, high IOUT), special care

must be paid to thermal dissipation issues in board design.

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