LP8557, LP85571

SNVSA15B – DECEMBER 2013 – REVISED DECEMBER 2015

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7 Specifications

7.1 Absolute Maximum Ratings

Over operating free-air temperature range (unless otherwise noted)

(1) (2)

MIN

MAX

UNIT

VDD

Voltage range on VDD pin

–0.3

6

V

VIO

Voltage range on digital IO pins

–0.3

6

V

VO

Voltage range on SW, FB, LED1 to LED6 pins

–0.3

31

V

TJ

Junction temperature

–30

125

°C

Tsldr

Maximum lead temperature (soldering)

260

°C

Tstg

Storage temperature range

–65

150

°C

(1)

Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings

only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended

Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

(2)

All voltage values are with respect to the potential at the GND pin.

7.2 ESD Ratings

VALUE

UNIT

Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001(1)

±2000

V(ESD)

Electrostatic discharge

V

Charged-device model (CDM), per JEDEC specification JESD22-C101(2)

±500

(1)

JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.

(2)

JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.

7.3 Recommended Operating Conditions

Over operating free-air temperature range (unless otherwise noted)

(1) (2)

MIN

MAX

UNIT

VDD

2.7

5.5

V

V (SW, FB, LED1 to LED6)

0

28

V

Ambient temperature, TA

–30

85

°C

Junction temperature, TJ

–30

125

°C

(1)

Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings

only, and functional operation of the device at these or any other conditions beyond those indicated under recommended operating

conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability

(2)

All voltage values are with respect to the potential at the GND pin.

7.4 Thermal Information

LP8557/LP8557I

THERMAL METRIC(1)(2)

YFQ (DSBGA)

UNIT

16 PINS

RθJA

Junction-to-ambient thermal resistance

75.7

°C/W

RθJC(top)

Junction-to-case (top) thermal resistance

0.5

°C/W

RθJB

Junction-to-board thermal resistance

16.2

°C/W

ψJT

Junction-to-top characterization parameter

0.2

°C/W

ψJB

Junction-to-board characterization parameter

16.2

°C/W

(1)

For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application

report, SPRA953.

(2)

Junction-to-ambient thermal resistance is highly application and board-layout dependent. In applications where high maximum power

dissipation exists, special care must be paid to thermal dissipation issues in board design.

4

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